发明名称 |
COMPONENT-INCORPORATING MODULE AND ITS MANUFACTURING METHOD |
摘要 |
[Problem] To provide a reliable component-embedded module that allows a reduction in cost and an increase in yield. [Solving Means] A component-embedded module A includes a module substrate 1 having wiring electrodes 2 on the upper surface thereof, first circuit components 7 mounted on the wiring electrodes 2, a sub-module 10 disposed on an area on which no wiring electrodes 2 are formed, and an insulating resin layer 20 formed on the entire upper surface of the module substrate in such a manner that the insulating resin layer 20 covers at least parts of the first circuit components and sub-module. The second circuit components 15 including an integrated circuit element are mounted on the sub-module 10 or embedded therein. Via conductors 3 are formed through the module substrate 1 from the lower surface thereof and are directly coupled to terminal electrodes 14 on the lower surface of the sub-module 10. By using a substrate having a wiring accuracy higher than that of the module substrate 1, a reliable component-embedded module is obtained. |
申请公布号 |
EP2141972(A4) |
申请公布日期 |
2011.01.05 |
申请号 |
EP20080740252 |
申请日期 |
2008.04.11 |
申请人 |
MURATA MANUFACTURING CO. LTD. |
发明人 |
YUDA, KAZUYUKI;IEKI, TSUTOMU |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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