| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solid-state imaging element storage case capable of inexpensively manufacturing in a short time and excellent in heat conduction, a resin used in manufacturing the case, and a solid-state imaging device using the case. <P>SOLUTION: A resin composition for use as the solid-state imaging element storage case contains 100 pts.wt. of (A), 10-100 pts.wt. of (B) and 20-150 pts.wt. of (C), the solid-state imaging element storage case is formed of the resin component, and the solid-state imaging device is packaged by means of the storage case, where (A) refers to liquid crystalline polymer, (B) refers to inorganic platelike filler, (C) refers to inorganic fibrous and/or inorganic needlelike filler with heat conductivity of 3 W/mK or higher, (D) refers to glass fiber, and (E) refers to epoxy group containing ethylene copolymer containing, in a molecule, ethylene units of 50-99.9 wt.%, unsaturated carbonic acid glycidyl ester and/or unsaturated glycidyl ether units of 0.1-30 wt.%. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
