首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
带MP4的音响
摘要
1.产品名称为:带MP4的音响;功能用途为:产品支持2.0声道立体声音响、MP3播放器和MP4播放器功能、数码像册功能、录音功能、FM收音机功能、时钟、万年历功能、音乐闹钟功能,可将任意歌曲设为闹钟铃声、支持外扩SD/MMC内存卡、支持USB host功能。2.设计要点在主视图,最能表明设计要点的图片为主视图。
申请公布号
CN301432531S
申请公布日期
2011.01.05
申请号
CN201030170076.1
申请日期
2010.05.11
申请人
张锦平;梁华
发明人
张锦平
分类号
14-01
主分类号
14-01
代理机构
代理人
主权项
地址
518000 广东省深圳市南山区西丽镇麻嵌村百顺工业区3栋4楼
您可能感兴趣的专利
STRUCTURE OF ENGINE ROOM
IMPACT-ABSORBING MEMBER FOR VEHICLE
VEHICULAR HANDLE DEVICE
VIBRATION DAMPING FOR A RANGE-EXTENDER
AXIALLY EXPANSIBLE PIPE ASSEMBLY
ANTI-COUNTERFEITING OPTO-THERMAL WATERMARK FOR ELECTRONICS
SKI BINDING PLATE
AXLE MOUNT FOR UTILITY VEHICLES
REAR WHEEL SUSPENSION DEVICE
CHILD SEAT CARRIAGE
Air shock absorber with smart suspension system with height adjustment without losing comfort and safety
SUSPENSION FOR WHEELED VEHICLES
ANTI-EXTRUSION CONE PACKING
CONTAINER AND PROCESS FOR MAKING THE SAME
CATHODE FOR LITHIUM-CONTAINING BATTERIES AND SOLVENT-FREE METHOD FOR THE PRODUCTION THEREOF
PACKAGE STRUCTURE HAVING SILICON THROUGH VIAS CONNECTED TO GROUND POTENTIAL
Semiconductor Arrangement, Method for Producing a Semiconductor Module, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement
Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
SEMICONDUCTOR DEVICE