Capped integrated device with protective cap, composite wafer incorporating integrated devices and process for bonding integrated devices with respective protective caps

摘要

A capped integrated device includes a semiconductor chip (29), incorporating an integrated device (10) and a protective cap (30), bonded to the semiconductor chip (29) for protection of the integrated device (10) by means of a bonding layer (25) made of a bonding material. The bonding material forms anchorage elements (27) within recesses (20), formed in at least one between the semiconductor chip (29) and the protective cap (30).