| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME |
| 摘要 |
A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention. |
| 申请公布号 |
EP1362364(B1) |
申请公布日期 |
2011.01.05 |
| 申请号 |
EP20020717346 |
申请日期 |
2002.01.17 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
BECKER, GREGORY;GARDNER, GEOFFREY;HARKNESS, BRIAN;MALENFANT, LOUISE;SARMAH, SATYENDRA |
| 分类号 |
H01L21/00;H01L23/12;G03F7/00;G03F7/075;G03F7/42;H01L23/14;H01L23/31 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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