| 摘要 |
The invention relates to a cooling arrangement, comprising two disc-shaped semiconductor components (1,2), in particular thyristors, disposed next to one another, with axes of symmetry aligned approximately parallel to one another, said components being held between two cooling body units (3, 6) by way of only one clamping means, wherein in the area between the two semiconductor components (1, 2) one cooling body unit (3) has a smaller cross sectional area or is divided and in the area of the axes of symmetry is pressed against a first pressure plate (4) by way of application points (5) at the cooling body side facing away from the semiconductor component (1, 2), in that a second pressure plate (7) coupled to the other cooling body unit (6) is braced to the first pressure plate (4) by way of tie rods. |
