| 摘要 |
A manufacturing method of a light emitting diode, especially to facilitate heat dissipation and light utilization of a chip, includes adding an etched metal circuit layer to a surface of high heat conducting substrate, covering the metal circuit layer with a soldering-proof protection film, performing a high-reflection surface treatment to an area between wire bonding regions to form a chip-embedded region, bonding the light emitting diode chip in the chip-embedded region, electrically connecting the chip to solder-joints of the wire bonding regions with wires, and coating an adhesive on the surface of entire substrate including the chip-embedded region and wire bonding regions, in order to accomplish a chip wiring and perform a following packaging operation to the light emitting diode. Therefore, the good heat conduction is provided, the light extraction effect of reflection is improved, and the practicability of light emitting diode is increased. |
