发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a mechanism of laminate device pressurization capable of easily obtaining a stable and fine pressure control pattern for an extensive pressure control range of a thermo-compression bonding step, obtaining high control accuracy over the extensive pressure control range from a low pressure to a high pressure, and enhancing the quality of an IC card or the like. <P>SOLUTION: The mechanism of the laminate device pressurization is provided with: a plurality of cylinder groups Bx and By having one or two or more secondary pressurization cylinders 3a and 3c to pressurize a pressurization table 2d; a plurality of primary pressurization cylinders 4x and 4y which are provided corresponding to the cylinder groups Bx and By, and connected to the secondary pressurization cylinders 3a and 3c of the corresponding cylinder groups Bx and By to drive the secondary pressurization cylinders 3a and 3c; and a drive control means 5 which selects one or two or more primary pressurization cylinders 4x and 4y to drive and control the primary pressurization cylinders 4x and 4y. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP4606003(B2) 申请公布日期 2011.01.05
申请号 JP20030296589 申请日期 2003.08.20
申请人 发明人
分类号 B30B1/32;B30B12/00;B30B15/34;G06K19/077 主分类号 B30B1/32
代理机构 代理人
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