发明名称 |
Method for producing electrical interlayer connection in substrate of micro-component or sensor, involves opening mask layer over substrate area provided for electrical interlayer connection, where mask layer is applied on substrate |
摘要 |
<p>The method involves opening a mask layer over a substrate area provided for the electrical interlayer connection. The mask layer is applied on the substrate (10). A through-hole is generated in the substrate area and an electrical interlayer connection is inserted in the through-hole. The mask layer partially remains in the area of the through-hole during opening of the mask layer, generation of the through-hole and insertion of the electrical interlayer connection. An independent claim is also included for a substrate with an opening recess.</p> |
申请公布号 |
DE102009027321(A1) |
申请公布日期 |
2011.01.05 |
申请号 |
DE20091027321 |
申请日期 |
2009.06.30 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
REINMUTH, JOCHEN;WILL, BARBARA;WEBER, HERIBERT |
分类号 |
H01L21/283;B81B7/02;H01L21/768;H01L23/482;H01L23/50 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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