发明名称 Verfahren zur Herstellung eines Lochs
摘要 <p>Production of a hole (7) in a component (1) using pulsed laser beams comprises using other laser pulse lengths in the first process steps than in the last process step. Preferred Features: Larger or smaller laser pulse lengths are used in the first process step than in the last process step. The laser pulse length is continuously enlarged during the progress of the hole formation from an outer surface (14) of the component to the depth of the hole. The component is a layer system consisting of a substrate (4) and a metallic layer (16) having a composition MCrAlX (where M = Fe, Co or Ni and X = Y or rare earth).</p>
申请公布号 DE50313280(D1) 申请公布日期 2011.01.05
申请号 DE2003513280 申请日期 2003.10.06
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BECK, THOMAS;BOSTANJOGLO, GEORG DR.
分类号 B23K26/38;B23K26/06 主分类号 B23K26/38
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