发明名称 |
Einrichtung und vorrichtung zur montage von bauteilen |
摘要 |
<p>A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at the component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted on a substrate such as circuit board. The component held by the placement head is recognized by an imaging device at or in the vicinity of the transfer station.</p> |
申请公布号 |
DE60143548(D1) |
申请公布日期 |
2011.01.05 |
申请号 |
DE2001643548 |
申请日期 |
2001.03.23 |
申请人 |
PANASONIC CORP. |
发明人 |
UENO, YASUHARU;MINAMITANI, SHOZO;KANAYAMA, SHINJI;SHIMIZU, TAKASHI;SIDA, SATOSHI;ONOBORI, SHUNJI |
分类号 |
H05K13/04;H01L21/60;H05K13/08 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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