发明名称 |
Methods for full gate silicidation of metal gate structures |
摘要 |
One embodiment relates to a method of fabricating an integrated circuit. In the method, p-type polysilicon is provided over a semiconductor body, where the p-type polysilicon has a first depth as measured from a top surface of the p-type polysilicon. An n-type dopant is implanted into the p-type polysilicon to form a counter-doped layer at the top-surface of the p-type polysilicon, where the counter-doped layer has a second depth that is less than the first depth. A catalyst metal is provided that associates with the counter-doped layer to form a catalytic surface. A metal is deposited over the catalytic surface. A thermal process is performed that reacts the metal with the p-type polysilicon in the presence of the catalytic surface to form a metal silicide. Other methods and devices are also disclosed.
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申请公布号 |
US7863192(B2) |
申请公布日期 |
2011.01.04 |
申请号 |
US20070965024 |
申请日期 |
2007.12.27 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
FRANK AARON;GONZALEZ, JR. DAVID;VISOKAY MARK R.;MONTGOMERY CLINT |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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