发明名称 |
Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit package system includes: forming a package substrate with a top substrate side and a bottom substrate side; forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate; mounting an integrated circuit device over the top substrate side; connecting an electrical interconnect between the integrated circuit device and the top substrate side; and forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.
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申请公布号 |
US7863726(B2) |
申请公布日期 |
2011.01.04 |
申请号 |
US20090612630 |
申请日期 |
2009.11.04 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
CHOW SENG GUAN;JANG TAE HOAN |
分类号 |
H01L23/48;H01L21/44;H01L21/48;H01L21/50;H01L23/02;H01L23/28;H01L23/29;H01L23/52;H01L23/544;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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