发明名称 |
Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program |
摘要 |
A pattern forming system 1 is configured to execute a series of processes, which includes a first heat process for performing a heat process on a substrate W after a resist liquid coating process, a light exposure process for performing light exposure on a resist film in accordance with a predetermined pattern, a second heat process for promoting a chemical reaction in the resist film after the light exposure, a developing process for developing the resist film after the light exposure, and an etching process for etching an oxide film by use of a resist pattern formed by the developing process as a mask. The system includes a checking apparatus 400 configured to measure and check a state of a pattern formed after the etching process, and a control section 500 configured to use a check result to set a condition for the first heat process and/or the second heat process so as to cause the state of the pattern to be uniform on a surface of the substrate W after the etching process.
|
申请公布号 |
US7862966(B2) |
申请公布日期 |
2011.01.04 |
申请号 |
US20060065809 |
申请日期 |
2006.09.13 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
OGATA KUNIE;TOMITA HIROSHI;TANAKA MICHIO;UEMURA RYOICHI |
分类号 |
G03C5/00;G03F1/00;H01L21/00;H01L21/027;H01L21/66 |
主分类号 |
G03C5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|