发明名称 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program
摘要 A pattern forming system 1 is configured to execute a series of processes, which includes a first heat process for performing a heat process on a substrate W after a resist liquid coating process, a light exposure process for performing light exposure on a resist film in accordance with a predetermined pattern, a second heat process for promoting a chemical reaction in the resist film after the light exposure, a developing process for developing the resist film after the light exposure, and an etching process for etching an oxide film by use of a resist pattern formed by the developing process as a mask. The system includes a checking apparatus 400 configured to measure and check a state of a pattern formed after the etching process, and a control section 500 configured to use a check result to set a condition for the first heat process and/or the second heat process so as to cause the state of the pattern to be uniform on a surface of the substrate W after the etching process.
申请公布号 US7862966(B2) 申请公布日期 2011.01.04
申请号 US20060065809 申请日期 2006.09.13
申请人 TOKYO ELECTRON LIMITED 发明人 OGATA KUNIE;TOMITA HIROSHI;TANAKA MICHIO;UEMURA RYOICHI
分类号 G03C5/00;G03F1/00;H01L21/00;H01L21/027;H01L21/66 主分类号 G03C5/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利