Disposable built-in self-test devices, systems and methods for testing three dimensional integrated circuits

摘要

A device and method for self-testing an integrated circuit layer for a three-dimensional integrated circuit includes integrally forming a disposable self-test circuit on a common substrate with a first circuit to be tested. The first circuit forms a layer in a three-dimensional integrated circuit structure. The first circuit is tested using circuitry of the self-test circuit. The self-test circuit is removed by detaching the self-test circuit from the first circuit.