发明名称 |
Array-molded package heat spreader and fabrication method therefor |
摘要 |
A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed in opposing sides of the heat spreader panels. Legs are formed on and extending downwardly from each of the heat spreader panels in at least an opposing pair of the slots on the heat spreader panels. The legs are integral with the respective heat spreader panels from which they depend.
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申请公布号 |
US7863730(B2) |
申请公布日期 |
2011.01.04 |
申请号 |
US20040921377 |
申请日期 |
2004.08.18 |
申请人 |
ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
SHIM IL KWON;RAMAKRISHNA KAMBHAMPATI;SAHAKIAN DIANE;CHOW SENG GUAN;FILOTEO, JR. DARIO S.;ARARAO VIRGIL COTOCO |
分类号 |
H01L23/367;H01L21/56;H01L21/98;H01L23/31;H01L23/433 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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