| 摘要 |
A semiconductor integrated circuit with tilted via connection and related method are provided, the circuit including a via layer having at least one tilted via, and a wireway layer having at least one elongated wireway disposed above the via layer, wherein the wireway connects to and partially overlaps the tilted via; and the method including forming a via layer, patterning a via trench in the via layer, forming a wireway layer, patterning an elongated wireway in the wireway layer, etching the patterned wireway and the patterned via, and filling the etched wireway and the etched via with a conductive material, wherein the filled wireway partially overlaps the filled via.
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