A LED ARRAY BOARD AND A PREPARING METHOD THEREFOR

摘要

PURPOSE: A light emitting diode(LED) array board and a method for manufacturing the same are provided to immediately emit light generated from an LED by contacting the bottom of the LED with a heat-sink integrated thermally conductive board. CONSTITUTION: An electrode circuit pattern is formed on a thermally conductive board(1) based on a thick-film printing technique. The electrode circuit pattern is the double-layered structure of insulating layer(4) and a conductive layer(5). The thermally conductive board is integrated with a heat-sink(21). The lead frame(11) of the LED is soldered to the conductive layer. The heat-sink slug(20) of the LED is combined with the thermally conductive board using a conductive binder.