METHOD FOR HANDLING A WAFER IN A WAXLESS TYPE AND APPARATUS FOR HANDLING A WAFER IN THE SAME TYPE

摘要

PURPOSE: A method for handling a wafer in a waxless type and an apparatus for handling a wafer in the same type are provided to increase the effectiveness of the whole grinding by demounting a wafer from a porous mounting pad in short time by spraying water and air. CONSTITUTION: A wafer is mounted in a wafer mounting space is absorbed to a porous mounting pad. A carrier block(110) is transferred to a wafer polishing apparatus to grind the mounted wafer. The carrier block is inclined to tilt the ground block. One or a plurality of water nozzle(150) around the edge of the mounted wafer sprays water to reduce adhesion between the wafer and the porous mounting pad. An air nozzle(160) sprays air between the wafer and the porous mounting pad to demount the wafer from the porous mounting pad.