THE PACKAGE OF POWER LIGHT EMITTING DIODE CHIP WITH REFLECTOR CUP AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An LED chip package with a reflector and a manufacturing method thereof are provided to reduce manufacturing processes and costs by integrating a reflector using the thickness of a chip frame. CONSTITUTION: A lead frame(100) with a reflector(300) made of Al is formed. The upper side of the lead frame is plated with platinum. An aluminum reflector and an LED chip(200) are bonded on the half-etched lead frame with a gold wire. The transparent synthetic resin liquid is coated on the aluminum reflector and the LED chip with a uniform thickness and is formed with a hemisphere. A sealing unit(700) is formed by coating conductive polymer compounds over 500 nano to prevent dust from being attached to the upper side of the hemispherical synthetic resin.