| 摘要 |
PURPOSE: A circuit board forming method is provided to reduce the defect occurrence by inspecting the defect occurring during the cutting a test stage through a contacting scan probe after inspecting the electrical property of a circuit board and implementing the inspection after cutting. CONSTITUTION: An electrode pattern is formed on a film substrate(S10). The electrical characteristic of the electrode pattern is inspected(S20). A driving IC is mounted after inspecting the electrical characteristic(S30). The operation state of the mounted driving IC is tested(S40). The test stage is cut after inspecting the operation state(S50).
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