LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: An LED package structure capable of improving the light emission efficiency and controlling a light emission angle, and a manufacturing method thereof are provided to offer a light emitting diode package structure capable of improving the light emission efficiency and controlling a light emission angle. CONSTITUTION: A substrate unit(1a) comprises a substrate main body and a chip mounting area arranged on the top of the substrate main body. A light emitting unit comprises a plurality of light emitting diode chips arranged on the chip mounting area of the substrate unit. A heat dissipation layer multiplies the heat dissipation effect of the circuit board.