METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CHIP HAVING INCLINED PLANE SECTION AND LASER SCRIBER USED BY THE SAME

摘要

PURPOSE: A method for manufacturing a semiconductor chip and a laser scriber used for the same are provided to easily form an inclined cross section on the semiconductor chip by forming a wedge shape inclined to one direction on the upper side of a substrate. CONSTITUTION: A semiconductor device(920) is mounted on a substrate(910). A wedge shape recess(930) inclined to one direction is formed on the upper side of the substrate. The wedge shaped recess is formed by a laser scriber. Impacts are periodically applied to the lower side of the substrate using a blade. The substrate is cleaved along the inclined direction of the wedge shaped recess.