| 摘要 |
PURPOSE: A polishing pad and a method for polishing a semiconductor wafer are provided to offer a semiconductor wafer of quality by removing the edge roll off on the edge area of the semiconductor wafer. CONSTITUTION: The polishing agent which does not contain the solid-state material is provided. The back side of the semiconductor wafer is grinded with the grinding pad including the abrasive fixed and combined. The front side of the semiconductor wafer is ground. The grinding pad comprises the abrasive layer and a compliant layer.
|
