| 摘要 |
The invention relates to controlling an under surface heating/cooling. During a heating mode, the room temperature is increased by increasing the flow of the liquid in a supply loop (3). If the set point has an increase that is greater than a pre-determined value, the supply temperature of the liquid is increased. During a cooling mode, the room temperature is decreased by increasing the flow of the liquid in the supply loop (3). Correspondingly, in response to a set-point change greater than a pre-determined value, the supply temperature of the liquid is temporarily decreased.
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