| 摘要 |
<p>42 METHOD FOR ATTACHING AND PEELING PRESSURE-SENSITIVE ADHESIVE SHEET, AND ATTACHING APPARATUS OF PRESSURE-SENSITTVE ADHEIVE SHEET ANT PEELING APPARATUS OF PRESSURIC-SENSITIVE ADHESIVE SHEET 5 ABSTRACT OF THE DISCLOSURE THE PRESENT INVENTION RELATES TO A METHOD FOR ATTACHING AND PEELING A PRESSURE- SENSITIVE ADHESIVE SHEET INCLUDINA: ATTACHIN- ON A SEMICONDUCTOR WAFER A PRESSURE- SENSITIVE ADHESIVE SHEET. HAVING A HEAT SHRINKABLE MATERIAL HAVIN- A HEAT SHRINKABILITY IN AT LEAST A UNIAXIAL DIRECTION, A RESTRICTION LAYER HAVING A PROPERTY OF OPPOSING A SHRINKAGE -10 DEFORMATION OF THE HEAT SHRINKABLE MATERIAL, AND AN ENERAY-BEAM-CURABLE PRESSURE- SENSITIVE ADHESIVE LAYER LAMINATED IN THIS ORDER; SUBJECTING- THE SEMICONDUCTOR WAFER ON WHICH THE PRESSURE-SENSITIVE ADHESIVE SHEET IS ATTACHED TO A PREDETERMINED TREATMENT, :FOLLOWED BY IRRADIATINGLBE SEMIWRLDUCTOR WAFER WITH AN ENERGY BEAM TO THEREBY CURE THE PRESSURE-SENSITIVE ADHESIVE LAYER-, AND HEATING THE PRESSURE-SENSITIVE ADHESIVE SHEET ,J5 AFTER THE CURING OF THE PRESSURE-SENSITIVE ADHESIVE LAYER TO THEREBY PEELING OFF THE PRESSURE-SENSITIVE ADHESIVE SHEET FROM THE SEMICONDUCTOR WAFER, IN WHICH, IN THE ARTACHINO PROCESS, THE PRESSURE-SENSITIVE ADHESIVE SHEET IS ATTACHED ON THE SEMICONDUCTOR WAFER IN SUCH A WAY THAT A NOTCH PORTION OF THESEMICODDUCTOR WAFER IS POSITIONED AT THE END IN THE DIRECTION OF THE BEAT SHTINKA,GE OF THE HEAT SHRH"BLE 20 MATERIAL. B),HEATIIIIZILIESENIICOIIDIICTOTNVAFER.THEPRESSURE-SENSITIVEADHESIVESLIECT RISES FROM A SITE OF THE NOTCLIPOTIJORLAND IS THEN PEELED WHILE SPONTANEOUSLY ROLLING UP IN ONE DIRECTION TO FORM A TUBULAR SHAPE, WHEREBY THE STRESS DURINO PEELING CAN BE DECREASED.</p> |
