| 摘要 |
PURPOSE: A method for polishing the edge of a semiconductor wafer is provided to polish the edge of a semiconductor wafer by applying the pressure to the semiconductor wafer and a polishing drum while supplying the polishing agent continuously. CONSTITUTION: A semiconductor wafer is prepared. The semiconductor wafer has the edge polished on both sides and having round-processes. The semiconductor wafer is fixed to the centrally rotating chuck. A polishing pad containing the abrasive fixed is attached to the polishing drum. The edge of the semiconductor wafer is polished by pressurizing the semiconductor wafer and polishing drum.
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