CARBON/EPOXY RESIN COMPOSITION, AND CARBON-EPOXY DIELECTRIC FILM PRODUCED BY USING THE SAME

摘要

PURPOSE: A carbon-epoxy dielectric film using carbon/epoxy resin composition is provided to manufacture various semiconductor device such as embedded capacitor. CONSTITUTION: A carbon-expoxy dielectric resin composition contains 60-90 weight% of bisphenol-based epoxy resin, 1-30 weight% of amine hardener, 0.1-3 weight% of imidazole curing catalyst, and 1-10 weight% of carbon black. The bisphenol epoxy resin is selected from the group consisting of bisphenol type A epoxy resin, bisphenol type F epoxy resin, bisphenol type AF epoxy resin and mixture thereof.