发明名称 METHODS AND APPARATUS FOR A GROUNDING GASKET
摘要 A conductive gasket includes a deformable contact region configured to provide compressive contact between the mounting surface of a connector (e.g., a right-angle micro-D connector) and a grounded surface of the substrate (e.g., PCB). A fastener region extends from the deformable contact region and is configured to align with a mounting region of the connector. A keep-out zone is provided adjacent to the deformable contact region and the fastener region and is configured to allow the pins of the connector to pass therethrough.
申请公布号 US2010330827(A1) 申请公布日期 2010.12.30
申请号 US20090492029 申请日期 2009.06.25
申请人 RAYTHEON COMPANY 发明人 FARMER DANIEL R.
分类号 H01R4/66 主分类号 H01R4/66
代理机构 代理人
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