发明名称 Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same
摘要 A plane-type heat-dissipating structure with high heat-dissipating effect includes a first heat-dissipating unit and a second heat-dissipating unit. The first heat-dissipating unit has an evacuated hollow heat-dissipating body, a plurality of supports integratedly formed in the hollow heat-dissipating body in order to divide an inner space of the hollow heat-dissipating body into a plurality of receiving spaces, and a plurality of microstructures integratedly formed on an inner surface of the hollow heat-dissipating body. Work liquid is filled into the receiving spaces. The second heat-dissipating unit is integratedly formed on an outer surface of the first heat-dissipating unit.
申请公布号 US2010326644(A1) 申请公布日期 2010.12.30
申请号 US20090458037 申请日期 2009.06.30
申请人 HUNG SHUI-HSU;LEE CHIEN-WEI;LEE SHIH-WEI 发明人 HUNG SHUI-HSU;LEE CHIEN-WEI;LEE SHIH-WEI
分类号 F28F3/04;B21D53/02 主分类号 F28F3/04
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