发明名称 |
Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same |
摘要 |
A plane-type heat-dissipating structure with high heat-dissipating effect includes a first heat-dissipating unit and a second heat-dissipating unit. The first heat-dissipating unit has an evacuated hollow heat-dissipating body, a plurality of supports integratedly formed in the hollow heat-dissipating body in order to divide an inner space of the hollow heat-dissipating body into a plurality of receiving spaces, and a plurality of microstructures integratedly formed on an inner surface of the hollow heat-dissipating body. Work liquid is filled into the receiving spaces. The second heat-dissipating unit is integratedly formed on an outer surface of the first heat-dissipating unit.
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申请公布号 |
US2010326644(A1) |
申请公布日期 |
2010.12.30 |
申请号 |
US20090458037 |
申请日期 |
2009.06.30 |
申请人 |
HUNG SHUI-HSU;LEE CHIEN-WEI;LEE SHIH-WEI |
发明人 |
HUNG SHUI-HSU;LEE CHIEN-WEI;LEE SHIH-WEI |
分类号 |
F28F3/04;B21D53/02 |
主分类号 |
F28F3/04 |
代理机构 |
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代理人 |
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地址 |
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