Method of producing electronic module, involves moving carrier to downstream processing point while aligning position of electronic component with respect to structure on liquid meniscus

摘要

The method involves arranging a structure (S) on the carrier (T). The structure is coated with a material (F) to form a liquid meniscus (M) such that the liquid meniscus is suitable to receive electronic component (B). The carrier with the structure is moved towards delivery point (A) so that electronic component received from delivery point partly touches material coated on structure. The carrier is moved to a downstream processing point while aligning position of electronic component with respect to structure on the liquid meniscus. The method involves moving carrier tape continuously using multiple carriers to the delivery point. The structure is formed on the carrier by applying material to surface of the carrier or by removing material from surface of the carrier. Several substructures are provided in the structure to delimit an area to form a liquid meniscus in each case such that the liquid meniscus is formed convexly relative to the structure. The solder material is coated on the structure such that solder material is melted at the time of forming liquid meniscus. The electronic component is set in contact with liquid meniscus at the time of aligning position of electronic component on the structure. The electronic component such as semiconductor chip is provided with metallic connecting contacts arranged on one side surface such that metallic connecting contacts of the electronic component faces the material coated on the structure. The metallic connecting contacts is oriented transversely to the surface of the material coated on the structure. Several electronic components are supplied to the delivery point so that semiconductor chips are adhered to the side of the carrier layer facing the carrier. The carrier layer is provided with the adhesive layer such that mechanical impulse is exerted on the appropriate semiconductor chip through carrier layer. The carrier is provided with an electrically conducting pattern such that electrically conducting pattern of carrier contacts connecting contacts of semiconductor chip. A flap is formed in the area of the carrier around predetermined path of the pattern so that the portion of the path on the flap contacts connecting contacts of semiconductor chip. The space between the carrier and the flap is filled with filler so that the semiconductor chip is partly embedded in the filler. Independent claims are included for the following: (1) device for producing electronic module, which comprises a conveying mechanism that is operated to move carrier with the structure to the delivery point. The energy feed facility initiates contactless delivery of the electronic components from the delivery point, while moving the structure on the carrier to the delivery point. Another conveying mechanism is operated to move the carrier to a downstream processing point; and (2) electronic module.