PROBE ASSEMBLY FOR ACCURATE SOLDERING

摘要

PURPOSE: A probe assembly is provided to remove the degradation of a solder. CONSTITUTION: A wiring board(20) forms a circuit pattern which includes a plurality of electrode pads in an upper part. A plurality of probes(10) comprises a bonding part welded in a plurality of electrode pads. A solder layer(30) is formed in the upper side of the plurality of electrode pads in order to be welded with the probe junction part and the electrode pad.