发明名称 |
SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER BONDING METHOD |
摘要 |
A solder joint structure include: a first terminal portion including a plurality of first terminal conductors adjacent to each other; a second terminal portion arranged opposite to the first terminal portion and including a plurality of second terminal conductors which are joined to the first terminal conductors; solders electrically connecting the first terminal conductors and the second terminal conductors; and member for suppressing flow of the solders.
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申请公布号 |
US2010326726(A1) |
申请公布日期 |
2010.12.30 |
申请号 |
US20100818542 |
申请日期 |
2010.06.18 |
申请人 |
FUJITSU LIMITED |
发明人 |
TANAKA HISAO;EMOTO SATOSHI;NASHIROZAWA KENICHI;MATSUSHIMA NANA;MASUYAMA TAKUMI |
分类号 |
H01R4/02 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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