| 摘要 |
The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip. placement of the electronic assembly consisting of the chip and the track segment at a predetermined position on the substrate, embedding of the chip and of the track segment into the substrate. A placement device used in the process and a portable object including an electronic assembly placed according to the process are also objects of the present invention.
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