Method of manufacturing semiconductor device, semiconductor inspection apparatus, and program

摘要

A reliability reference storage unit stores reference data for dividing semiconductor devices into equal to or more than three reliability ranks on the basis of the magnitude of an overlay error between a first interconnect layer and a second interconnect layer disposed over the first interconnect layer. An error storage unit stores overlay errors measured at multiple points within the surface of a semiconductor wafer. An error calculation unit calculates the overlay errors for a plurality of semiconductor chips on the basis of the coordinates of the plurality of semiconductor chips within the surface of the semiconductor wafer and the overlay errors stored in the error storage unit. A reliability information providing unit provides reliability information indicating reliability ranks to the plurality of semiconductor chips on the basis of the overlay errors for the plurality of semiconductor chips and reference data.