HIGH HEAT-CONDUCTIVITY COMPOSITE MATERIAL AND METHOD FOR PRODUCING THEREOF

摘要

The invention relates to high heat-conductivity materials , in particular diamond-copper materials for use in heat exchangers, heat sinks, heat dissipators in electronic and other devices and to method for producing thereof. According to the invention a high heat-conductivity diamond-copper composite has heat conductivity exceeding 500 W(m*K) and consists of diamond particles with coating in metal matrix having heat conductivity at least 300 W(m*K), the diamond particles are covered by one-layer solid coating with high surface area consisting of a metal and/or carbide of carbide-forming element IV-VI groups of Periodic Table, the coating is less 500 mkm thick and a surface relief for providing high adhesion of the metal matrix with to coated diamond particles and forming high conductivity durable composite. The composite is produced by infiltration of metal melt, e.g. copper or silver into a dense bed of diamond particles with a precovered coating.