| 摘要 |
A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions.
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