发明名称 Optical Proximity Sensor Package with Molded Infrared Light Rejection Barrier and Infrared Pass Components
摘要 An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a substantially optically non-transmissive infrared light barrier component. The infrared light barrier component substantially attenuates or blocks the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.
申请公布号 US2010327164(A1) 申请公布日期 2010.12.30
申请号 US20090495739 申请日期 2009.06.30
申请人 AVAGO TECHNOLOGIES ECBU (SINGAPORE) PTE. LTD. 发明人 COSTELLO JAMES;SARAVANAN RANI
分类号 G01J5/02;H05K3/30 主分类号 G01J5/02
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