| 摘要 |
A colloidal silica having a modified surface, characterized in that the surface of the colloidal silica has been modified with at least one of groups represented by general formulae (1), (2), and (3); and a polishing composition for CMP which contains the colloidal silica. When this polishing composition for CMP is used, first-stage polishing in CMP can be conducted without leaving an unpolished area while inhibiting dishing from being enhanced, and fanging can be reduced in second-stage polishing. |
