| 摘要 |
After disposing bonding material including thermosetting resin containing solder particles in a region that covers at least land part on an upper surface of base wiring layer and holding electronic component by base wiring layer by positioning terminal part with respect to land part and adhesively bonding at least terminal part to bonding material that covers at least land part, bonding material is semi-cured by heating. Therefore, warp deformation of the base wiring layer can be suppressed and bonding reliability can be secured. |
