发明名称 PHASE-CHANGE-TYPE HEAT SPREADER, FLOW-PATH STRUCTURE, ELECTRONIC APPARATUS,AND METHOD OF PRODUCING A PHASE-CHANGE-TYPE HEAT SPREADER
摘要 [Object] To provide a phase-change-type heat spreader, a flow-path structure, an electronic apparatus including the phase-change-type heat spreader, a flow-path structure used therein, and the like that are capable of improving a thermal efficiency by a phase change and lowering a thermal resistance. [Solving Means] Capillary boards (401 to 404) in which a plurality of openings (408) penetrating the capillary boards are formed on a wall surface constituting grooves (405) in a longitudinal direction of the grooves (405), are laminated while each being rotated 90 degrees to be deviated within an X-Y plane so that the grooves (405) of those layers extend in mutually-orthogonal directions, and the plurality of openings (408) function as a part of a vapor-phase flow path through which a vapor refrigerant evaporated by heat received by a heat-receiving plate circulates.
申请公布号 US2010326632(A1) 申请公布日期 2010.12.30
申请号 US20080733567 申请日期 2008.08.08
申请人 SONY CORPORATION 发明人 NAGAI HIROYUKI;RYOSON HIROYUKI;YAJIMA TAKASHI;HASHIMOTO MITSUO
分类号 F28D15/04;B21D53/02;F28D15/00 主分类号 F28D15/04
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