| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to uniformly form the thickness of a conductive metal by controlling the amount of a conductive metal. CONSTITUTION: An insulating substrate(11), a base metal layer(13), and a conductive metal layer(15) are arranged in a conductive metal layer added insulation substrate(10). A part of the conductive metal layer is removed by an etching process. A photoresist layer(20) is formed on the surface of the conductive metal layer. A mask(22), which has a required pattern, is arranged on the photoresist layer. The photoresist layer is exposed by irradiating light from a light source part(24). A pattern(28), which is consisted of a remaining photoresist, is formed by a photolithography process. A narrow wiring pattern and a wide wiring pattern are formed according to the width of the pattern.
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