发明名称 Method of forming contact hole arrays using a hybrid spacer technique
摘要 One embodiment of the invention provides a method of forming a plurality of contact holes, including forming a first feature and a second feature over an underlying material, forming sidewall spacers on the first and second features, removing the first and second features without removing the sidewall spacers, forming a cover mask at least partially exposing the sidewall spacers, and etching the underlying material using the cover mask and the sidewall spacers as a mask to form the plurality of contact holes.
申请公布号 US2010330806(A1) 申请公布日期 2010.12.30
申请号 US20090458017 申请日期 2009.06.29
申请人 SANDISK 3D LLC 发明人 WANG CHUN-MING;HUANG CHENCHE;HIGASHITANI MASAAKI
分类号 H01L21/768 主分类号 H01L21/768
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