发明名称 PLASMA TREATMENT METHOD
摘要 <p>A method for manufacturing a semiconductor device having fluorocarbon layers as insulating layers includes the steps of forming a first fluorocarbon (CFx1) layer using plasma excited by microwave power and forming a second fluorocarbon (CFx2) layer using plasma excited by an RF power.</p>
申请公布号 WO2010151336(A1) 申请公布日期 2010.12.29
申请号 WO2010US01832 申请日期 2010.06.25
申请人 TOKYO ELECTRON LIMITED;TAKABA, HIROYUKI 发明人 TAKABA, HIROYUKI
分类号 C23C16/00;H01L21/203;H01L29/30 主分类号 C23C16/00
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