DRIVE DEVICE

摘要

Electronic circuits (50, 70), including semiconductor modules (501-506) and capacitors (701-706), are disposed in the axis direction of a motor (30). The semiconductor modules (501-506) are perpendicularly disposed in contact with a heat sink (601). The perpendicular lines of the surfaces of the semiconductor chips provided in the semiconductor modules (501-506) are perpendicular to the axis line of the motor (30). The capacitors (701-706) are disposed such that at least a part of the region wherein the capacitors (701-706) are disposed, said region being in the axis direction of the motor (30), overlaps the region wherein the semiconductor modules (501-506) and the heat sink (601) are disposed, said region being in the axis direction.