ACCELERATION SENSOR

摘要

Provided is an acceleration sensor, which has, in the vicinity of electrode pads, an improved reliability using a wafer-level package. The acceleration sensor (100) has: a sensor section (110) composed of Al wiring (116) which connects an acceleration detecting element with the electrode pads (115a-115d) formed on a frame (111); a protection film (117) laminated on the Al wiring (116) formed on the frame (111) and the part of each of the electrode pads (115a-115d); a cap section (118) which covers the sensor section (110) and houses the sensor section (110) in a hermetically sealed space; and a bonding layer (119) which is laminated on the protection film (117) and bonds together the sensor section (110) and the cap section (118).