| 摘要 |
<p>The resin seal properties of a module having a built-in component are improved such that there are no resin fill defects, and there are none of the post-production short circuit defects (solder bridging, etc.) that accompany resin fill defects of a module having a built-in component. An opening (4) at the component mounting position on a metal foil (2) is formed to a predetermined small surface area, which is smaller than the electrode surface area on the electrode mounting surface side of a component (3) to be mounted, solder (5) is applied to the opening (4), the solder (5) is heated and melted by reflow with an electrode (31) of the component (3) positioned on top of the solder (5), the molten solder (5) rises due to surface tension, and the component (3), which has been raised by the solder (5), is bonded to the solder (5) and mounted such that there is a large space formed underneath the component (3). Once the component (3) has been mounted, the space underneath the component (3) is reliably filled with resin which is then cured to form a sealing resin layer (6) without any space underneath the component (3), and the resin seal properties of the resulting module having a built-in component are improved.</p> |
