ULTRASONIC BONDING TOOL, METHOD FOR MANUFACTURING ULTRASONIC BONDING TOOL, ULTRASONIC BONDING METHOD, AND ULTRASONIC BONDING APPARATUS

摘要

Disclosed is an ultrasonic bonding tool that can bond a lead wire even to a surface of a thin-film base such as a glass substrate having a thickness of not more than 2 mm without any problem.  A surface part in a chip part (1c) in an ultrasonic bonding tool (1) for use in an ultrasonic bonding apparatus comprises a plurality of flat parts (10) provided separately from each other and a plurality of concaves (11) each provided between adjacent flat parts in the plurality of flat parts.  Each of the plurality of flat parts (10) has a flatness of not more than 2 µm.