RESIN COMPOSITION FOR SEALING SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE

摘要

Provided is a resin composition for sealing semiconductors comprising a hardening agent, an epoxy resin (B), and an inorganic filler (C), that is characterized in that the hardening agent is a phenolic resin (A) with a predetermined structure. Also provided is a semiconductor device characterized in that a semiconductor element can be obtained by being sealed with the hardened material of the resin composition for sealing semiconductors.