发明名称 |
ULTRASONIC BONDING TOOL, METHOD FOR MANUFACTURING ULTRASONIC BONDING TOOL, ULTRASONIC BONDING METHOD, AND ULTRASONIC BONDING APPARATUS |
摘要 |
Disclosed is an ultrasonic bonding tool that can bond a lead wire even to a surface of a thin-film base such as a glass substrate having a thickness of not more than 2 mm without any problem. A surface part in a chip part (1c) in an ultrasonic bonding tool (1) for use in an ultrasonic bonding apparatus comprises a plurality of flat parts (10) provided separately from each other and a plurality of concaves (11) each provided between adjacent flat parts in the plurality of flat parts. Each of the plurality of flat parts (10) has a flatness of not more than 2 µm. |
申请公布号 |
WO2010150350(A1) |
申请公布日期 |
2010.12.29 |
申请号 |
WO2009JP61384 |
申请日期 |
2009.06.23 |
申请人 |
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION;YOSHIDA AKIO;KOGURA MASAHISA |
发明人 |
YOSHIDA AKIO;KOGURA MASAHISA |
分类号 |
B06B1/02;B23K20/10 |
主分类号 |
B06B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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